LEXAN™ JK2500 Opaque Copolymer PC/ABS Blend. 20% Carbon Reinforced

LEXAN™ JK2500 PC/ABS Copolymer Resin is a High-Performance Conductive Engineering Thermoplastic designed for applications requiring EMI/RFI Shielding, Structural Strength, and reliable Flame Retardant Performance. This Opaque PC/ABS Blend combines 20% Carbon Fibre Reinforcement with Conductive Technology and a Non-Brominated, Non-Chlorinated Flame Retardant System, making it suitable for Electronic, Telecommunications, Industrial, and Electrical Equipment where Electromagnetic Protection is Essential.

A Defining Feature of LEXAN™ JK2500 PC/ABS Copolymer Resin is its ability to provide both Electrical Conductivity and EMI/RFI Shielding within a Single material Solution. The Conductive Carbon Fibre Network helps Dissipate Electrical Charges while Protecting Sensitive Electronics from Electromagnetic and Radio Frequency Interference. This makes the material particularly valuable for Electronic Housings, Communication Devices, Network Hardware, and Data Infrastructure Systems.

The PC/ABS Copolymer Platform combines the Heat Resistance and Toughness of Polycarbonate with the Processability and Dimensional Stability of ABS. as a Result, LEXAN™ JK2500 PC/ABS Copolymer Resin delivers a balanced combination of Mechanical Durability, Processing Efficiency, and Long-Term Reliability, supporting demanding Engineering applications.

Structural performance is further enhanced through 20% Carbon Fibre Reinforcement. This Reinforcement Increases Stiffness, Strength, and Dimensional Stability while helping reduce Overall Component Weight compared with Traditional Metal Shielding Solutions. The material Therefore enables Lightweight Designs without Sacrificing Mechanical Integrity or Functional Performance.

To support Modern Environmental and Regulatory Requirements, LEXAN™ JK2500 PC/ABS Copolymer Resin Utilizes a Non-Brominated and Non-Chlorinated Flame Retardant System. This Non-Halogenated formulation provides Dependable Fire Safety performance while maintaining the Conductivity, Mechanical Properties, and Processing characteristics required for Advanced Electronic applications.

Processing performance remains Strong, allowing efficient Injection Moulding of Complex components with Precise Dimensions and consistent Surface Quality. The combination of Conductivity, EMI/RFI Shielding Capability, Structural Strength, and Flame Retardancy supports the Manufacture of Sophisticated Parts used in High-Technology Industries.

Typical applications for LEXAN™ JK2500 PC/ABS Copolymer Resin include 5G Infrastructure Equipment, Telecommunications Components, Network Devices, Electronic Enclosures, Industrial Controllers, Power distribution Systems, and Shielded Electronic Housings where Electrical Protection and Structural reliability must be Delivered together.

LEXAN™ JK2500 PC/ABS Copolymer Resin is also RoHS Compliant, supporting Environmentally Responsible material selection and alignment with Global Regulatory Standards. by enabling Durable, Long-Life Electronic Products with Integrated EMI/RFI Shielding and Mechanical Strength, the material supports the Development of reliable and Sustainable Engineering Solutions.

Notes:

LEXAN™ JK2500 PC/ABS Copolymer Resin
20% Carbon Fibre Reinforced
Conductive Grade for EMI/RFI Shielding
Non-Brominated and Non-Chlorinated Flame Retardant
Excellent Strength, Stiffness and Dimensional Stability
Suitable for Electronics, Telecommunications and Industrial Equipment
UL94 V-0 Rated from 1.00 mm to 3.00 mm
RoHS Compliant