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STAT-KON DX04489C Compound. Polycarbonate, 30% Carbon Fiber Reinforced

Clean Compounding Technology with High Stiffness & High Modulus

LNP™ STAT-KON™ DX04489C Compound is a High-Performance Polycarbonate (PC) Compound Reinforced with 30% Carbon Fiber, engineered for Semiconductor, Electronics, Automation and Contamination-Sensitive Manufacturing applications requiring Exceptional Conductivity, Structural performance and Cleanliness. Manufactured using Advanced LNP™ Clean Compounding Technology, STAT-KON™ DX04489C delivers a unique combination of Electrical Conductivity, High Stiffness, Low Contamination and Flame-Retardant performance for demanding Engineering Environments.

Built on a Durable Polycarbonate Resin Platform, LNP™ STAT-KON™ DX04489C Compound combines the Toughness of Polycarbonate with the Exceptional Reinforcement Benefits of 30% Carbon Fiber Loading. This High Level of Reinforcement significantly Improves Stiffness, Modulus and Structural Strength, making the material suitable for Lightweight Structural components that must maintain Dimensional Accuracy under Mechanical and Thermal Stress.

A Key Advantage of STAT-KON™ DX04489C is its Conductive Performance. The Compound provides a Surface Resistivity range of approximately 1 × 10² to 1 × 10⁶ Ω, enabling reliable Static Dissipation and Conductivity for applications where Electrostatic Discharge Protection is Critical. This makes the material suitable for Semiconductor Equipment, Electronics Manufacturing Systems, Wafer Handling Devices and Precision Automation Components.

Unlike Conventional Conductive Compounds, LNP™ STAT-KON™ DX04489C is Produced using LNP™ Clean Compounding Technology, specifically developed to reduce Contamination Sources in Clean Manufacturing Environments. The Compound features Low Ionic Contamination, including reduced Levels of Nitrates, Chlorides and Sulfates, helping to Minimize Contamination Risks that can affect Semiconductor Yields and Sensitive Electronic Processes.

Another important benefit is its Low Outgassing Performance. The formulation is engineered to Minimize Volatile Emissions, helping reduce Contamination of critical Surfaces and supporting Cleaner Manufacturing Operations. These characteristics Help Lower the Potential for Wafer Damage while Promoting more accurate and reliable Sensor Readings, Measurements and Manufacturing Data Collection.

The 30% Carbon Fiber Reinforcement contributes Exceptional Stiffness, High Strength and High Modulus Performance. compared with Lower-Filled Conductive Grades, STAT-KON™ DX04489C Compound delivers Superior Structural Properties, making it particularly well suited for Precision Equipment, Fixtures and Load-Bearing components requiring Lightweight Yet highly Rigid Construction.

The Polycarbonate Matrix additionally provides good Toughness and Dimensional Stability, allowing Complex Molded Parts to maintain performance under varying Operating Conditions. combined with the High Carbon Fiber Content, this results in a Conductive Engineering material Capable of delivering Long-Term reliability in Challenging Environments.

The Compound Achieves a UL94 V-2 Rating at 1.5 mm, providing Flame-Retardant performance alongside its Conductivity and Structural Benefits. This makes the material suitable for applications where both Fire performance and Electrostatic Control are required.

Because of its combination of Conductivity, Cleanliness, Flame Resistance and Exceptional Mechanical Performance, LNP™ STAT-KON™ DX04489C Compound is commonly used in Semiconductor Manufacturing Equipment, Wafer Handling Systems, Electronic Production Equipment, Automation Systems, Conductive Fixtures and Precision Structural Components.

In addition to its Electrical and Mechanical Advantages, LNP™ STAT-KON™ DX04489C Compound is RoHS Compliant, supporting Compliance with Global Environmental Regulations while maintaining the Advanced performance characteristics required in Modern Electronics and Semiconductor Industries.


Notes:

LNP™ STAT-KON™ DX04489C Compound
Polycarbonate (PC) Resin
30% Carbon Fiber Reinforced
Electrically Conductive
Surface Resistivity: 1 × 10² to 1 × 10⁶ Ω
LNP™ Clean Compounding Technology
Low Ionic Contamination
Low Nitrates, Low Chlorides
Low Sulfates
Low Outgassing Performance
UL94 V-2 Rated at 1.5 mm
RoHS Compliant



STAT-KON™ DX04489C Resin has a Flexural Modulus of 15530 MPa. ASTM D790

STAT-KON™ DX04489C Resin offers a Tensile Strain, Break, of 2.4%. ASTM D638

SABIC LNP™ STAT-KON™ DX04489C compound offer HDT, 1.82 MPa of 140°C

LNP™ STAT-KON™ DX04489C Compound Resin has - % Shrinkage, Along flow

STAT-KON® DX04489C Compound are UL94 - V2 @ 1.5 mm

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