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STAT-KON DX05301C Polycarbonate Compound with Conductive Carbon Powder

Low Particle Count, Low Ionics, Low Outgassing, Clean Compounding Tech

LNP™ STAT-KON™ DX05301C Compound is a specialized Polycarbonate (PC) Compound formulated with Conductive Carbon Powder Fillers and Manufactured using Advanced LNP™ Clean Compounding Technology. Designed for Semiconductor, Electronics, Automation and Contamination-Sensitive Environments, STAT-KON™ DX05301C combines Electrical Conductivity with Low Particulate Generation, Low Ionic Contamination and Low Outgassing Performance, helping Improve Manufacturing reliability and Process Cleanliness.

Built on a durable Polycarbonate Resin Platform, LNP™ STAT-KON™ DX05301C Compound delivers excellent Dimensional Stability, Mechanical Strength and Processing Consistency. The Conductive Carbon Powder Network provides controlled Electrostatic Dissipation while maintaining the Structural performance and Toughness Associated with Engineering-Grade Polycarbonate Materials.

A Key Advantage of STAT-KON™ DX05301C is its controlled Conductivity Profile. The Compound Exhibits a Surface Resistivity range of approximately 1 × 10⁵ to 4.5 × 10⁸ Ω, making it suitable for Static Dissipative and Conductivity-Controlled applications where Electrostatic Charge Buildup must be Minimized. This performance supports Semiconductor Processing Equipment, Electronic Assembly Systems, Precision Automation Equipment and Contamination-Sensitive Industrial applications.

Unlike Conventional Conductive Compounds, LNP™ STAT-KON™ DX05301C is Produced using Proprietary LNP™ Clean Compounding Technology, specifically developed for applications requiring Stringent Contamination Control. The material is engineered to reduce Contamination Sources that can Negatively Impact Semiconductor Manufacturing, Electronics Assembly and Cleanroom Operations.

One of the Most important features of STAT-KON™ DX05301C Compound is its Low LPC (Low Particle Count) Performance. By minimizing Particulate Generation, the material helps support Cleaner Operating Environments and reduce Contamination-Related Process Issues in Advanced Manufacturing Facilities.

The Compound also offers Low Ionic Contamination, including reduced Levels of Ionic Residues that can Potentially Interfere with Sensitive Electronic and Semiconductor Manufacturing Processes. This Characteristic helps Improve Process reliability and supports Higher Manufacturing Yields.

Another Major benefit is its Low Outgassing Performance. The formulation is designed to Minimize Volatile Emissions, reducing Contamination Risks for critical Surfaces, Optical Systems and Semiconductor Wafers. This makes the Compound suitable for Cleanroom Equipment, Wafer Handling components and Precision Manufacturing Devices.

The Polycarbonate Matrix contributes High Stiffness and High Strength, enabling Molded Parts to maintain Dimensional Stability and Mechanical performance even under demanding Operating Conditions. These Structural properties make STAT-KON™ DX05301C Compound suitable for Precision components requiring both Cleanliness and Durability.

The material Achieves a UL94 HB Rating from 1.0 mm to 3.2 mm, providing Basic Flammability performance while maintaining Conductivity and Contamination-Control Characteristics.

Because of its combination of Conductivity, Cleanliness, Dimensional Stability and Mechanical Strength, LNP™ STAT-KON™ DX05301C Compound is commonly used in Semiconductor Equipment, Wafer Handling Systems, Electronic Manufacturing Tools, Cleanroom Automation Equipment, Industrial Fixtures and Static Dissipative applications.

In addition to its Electrical and Mechanical Advantages, LNP™ STAT-KON™ DX05301C Compound is RoHS Compliant, supporting Compliance with Global Environmental Regulations while maintaining Advanced Engineering Performance.

Notes:

LNP™ STAT-KON™ DX05301C Compound
Polycarbonate (PC) Resin
Conductive Carbon Powder Filled
Surface Resistivity: 1 × 10⁵ to 4.5 × 10⁸ Ω
LNP™ Clean Compounding Technology
Low Particle Count (LPC)
Low Ionic Contamination
Low Outgassing Performance
UL94 HB Rated at 1.0 mm to 3.2 mm
RoHS Compliant

STAT-KON™ DX05301C Resin has a Flexural Modulus of 2490 MPa. 2 mm/min ISO 178

STAT-KON™ DX05301C Resin offers a Tensile Strain, Break, 5 mm/min of 1.5%. ISO 527

SABIC LNP™ STAT-KON™ DX05301C compound offer HDT, 1.82 MPa of 132°C

LNP™ STAT-KON™ DX05301C Compound Resin has 0.6% Shrinkage, Along flow

STAT-KON® DX05301C Compound are UL94 - HB @ 1.0 mm ~ 3.2 mm

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