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STAT-KON DX05305C Polycarbonate Compound with Conductive Carbon Powder

Low Particle Count, Low Ionics, Low Outgassing, Clean Compounding Tech

LNP™ STAT-KON™ DX05305C Compound is a specialized Electrically Conductive Polycarbonate (PC) Compound developed for Semiconductor, Electronics, Automation and Contamination-Sensitive Manufacturing Environments requiring Conductivity, Dimensional Stability and Exceptional Cleanliness Performance. formulated with Conductive Carbon Powder Fillers and Manufactured using Advanced LNP™ Clean Compounding Technology, STAT-KON™ DX05305C delivers reliable Electrostatic Control while helping Minimize Contamination Risks from Particles, Ionic Residues and Volatile Emissions.

Built on a robust Polycarbonate Resin Platform, LNP™ STAT-KON™ DX05305C Compound combines the Toughness and Dimensional Stability of Polycarbonate with controlled Electrical Conductivity. The Carbon Powder Technology creates an Effective Conductive Network throughout the Material, enabling Static Dissipation without Sacrificing Structural performance or Processing Consistency.

A Key Advantage of STAT-KON™ DX05305C is its Conductive Performance. The Compound Exhibits a Surface Resistivity range of approximately 1 × 10² to 1 × 10⁵ Ω, making it suitable for Conductive and Static Dissipative applications where Electrostatic Discharge Protection is Essential. This Conductive range supports use in Semiconductor Equipment, Wafer Handling Systems, Electronics Manufacturing Equipment and Precision Automation Components.

Unlike Conventional Conductive Engineering Plastics, LNP™ STAT-KON™ DX05305C is Produced Utilizing Proprietary LNP™ Clean Compounding Technology. This Advanced Manufacturing Process is specifically designed to reduce Contamination Sources that can affect Sensitive Manufacturing Operations and Cleanroom applications.

The material features Low LPC (Low Particle Count) Characteristics, helping reduce Particulate Generation that may Impact Semiconductor Fabrication, Electronics Production and High-Precision Assembly Environments. This makes the Compound particularly attractive for applications where Process Cleanliness directly Influences Product Quality and Yield.

Another important benefit is its Low Ionic Contamination Profile. The Compound is engineered to Minimize Ionic Contaminants, helping maintain Cleaner Operating Environments and reducing the Potential for Contamination-Related Failures in Sensitive Electronic and Semiconductor applications.

In addition, LNP™ STAT-KON™ DX05305C Compound Demonstrates Low Outgassing Performance, helping reduce Volatile Emissions that can Deposit on critical Surfaces or Interfere with High-Precision Manufacturing Processes. The combination of Low Particle Generation, Low Ionics and Low Outgassing support Cleaner Manufacturing Conditions and improved Process Reliability.

The Polycarbonate Resin Matrix further contributes High Stiffness, High Strength and excellent Dimensional Stability, enabling manufacturers to produce Precision-Molded components Capable of maintaining Tight Tolerances under demanding Operating Conditions. The material also offers the Processing Advantages of Polycarbonate, supporting efficient Manufacturing and consistent Part Quality.

Because of its combination of Conductivity, Cleanliness and Structural Durability, LNP™ STAT-KON™ DX05305C Compound is widely used in Semiconductor Processing Equipment, Wafer Handling Systems, Electronics Manufacturing Equipment, Automated Handling Systems, Static Dissipative Fixtures and Contamination-Sensitive Industrial applications.

In addition to its Electrical and Mechanical Advantages, LNP™ STAT-KON™ DX05305C Compound is RoHS Compliant, supporting Compliance with Global Environmental Regulations that Restrict the use of Hazardous Substances in Electrical and Electronic Equipment. This Assists manufacturers in achieving Sustainability and Regulatory Objectives while maintaining reliable Engineering Performance.

Notes:

LNP™ STAT-KON™ DX05305C Compound
Polycarbonate (PC) Resin
Conductive Carbon Powder Filled
Electrically Conductive
Surface Resistivity: 1 × 10² to 1 × 10⁵ Ω
LNP™ Clean Compounding Technology
Low Particle Count (LPC)
Low Ionic Contamination
Low Outgassing Performance
RoHS Compliant

STAT-KON™ DX05305C Resin has a Flexural Modulus of 2650 MPa. 2 mm/min ISO 178

STAT-KON™ DX05305C Resin offers a Tensile Strain, Break, 5 mm/min of 5.9%. ISO 527

SABIC LNP™ STAT-KON™ DX05305C compound offer HDT, 1.82 MPa of 135°C

LNP™ STAT-KON™ DX05305C Compound Resin has 0.5 ~0.7% Shrinkage, Along flow

STAT-KON® DX05305C Compound are Non UL94 Listed

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