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STAT-KON DX99873C Compound. Polycarbonate, 25% Carbon Fiber Reinforced

Clean Compounding Technology, Low C18-C40 Hydrocarbons & High flow

LNP™ STAT-KON™ DX99873C Compound is a High-Performance Polycarbonate (PC) Compound Reinforced with 25% Carbon Fiber, engineered for Semiconductor, Electronics, Automation and Contamination-Sensitive Manufacturing applications requiring Electrical Conductivity, Exceptional Structural performance and Advanced Cleanliness Characteristics. Manufactured using LNP™ Clean Compounding Technology, STAT-KON™ DX99873C combines Conductivity, High Stiffness, excellent Flowability and Low Contamination properties to support demanding applications where Precision and reliability are Critical.

Built on a Premium Polycarbonate Resin Platform, LNP™ STAT-KON™ DX99873C Compound delivers the Toughness and Dimensional Stability Associated with Polycarbonate while significantly Enhancing Mechanical performance through 25% Carbon Fiber Reinforcement. This Advanced Reinforcement provides High Strength, High Modulus and Superior Rigidity, making the material suitable for Lightweight Structural components Operating in demanding Environments.

A Key Advantage of STAT-KON™ DX99873C is its Conductive Performance. The Compound Exhibits a Surface Resistivity range of approximately 1 × 10² to 1 × 10⁶ Ω, providing reliable Electrostatic Discharge Control and Conductivity. This makes the material suitable for Semiconductor Equipment, Wafer Handling Systems, Precision Automation Devices, Electronic Manufacturing Equipment and Conductive Structural Components.

Unlike Conventional Conductive Engineering Compounds, LNP™ STAT-KON™ DX99873C is Manufactured using Proprietary LNP™ Clean Compounding Technology, specifically developed to reduce Contamination Risks in highly Sensitive Production Environments. The formulation features reduced Ionic Contamination Levels, including Lower Concentrations of Nitrates, Chlorides and Sulfates, helping protect Sensitive Manufacturing Processes and Improve Product Yields.

Another important benefit is its Low Outgassing Performance. The Compound is engineered with reduced Volatile content and Low C18-C40 Hydrocarbon Levels, helping Minimize Contamination of Sensitive Surfaces and Equipment. These characteristics support Cleaner Operating Environments and Help reduce the Potential for Wafer Damage while enabling more reliable Sensor Readings, Process Monitoring and Data Collection.

The 25% Carbon Fiber Reinforcement provides Exceptional Structural Performance, delivering High Stiffness, High Strength and High Modulus while maintaining a Lightweight Profile. This combination makes STAT-KON™ DX99873C Compound an excellent Alternative to Heavier Metallic Materials in applications requiring Rigidity, Conductivity and Dimensional Accuracy.

A further Advantage is its High Flow Formulation, which supports efficient Molding of Complex Geometries and Thin-Wall Components. improved Flow characteristics Help manufacturers achieve excellent Mold Filling, consistent Dimensional Control and enhanced Production Efficiency without Compromising Mechanical Performance.

The Compound also offers High Heat Resistance and excellent Dimensional Stability, allowing components to retain their performance under Elevated Temperatures and demanding Operating Conditions. These properties are particularly valuable for Semiconductor and Electronics Manufacturing applications where Precision and reliability are Critical.

LNP™ STAT-KON™ DX99873C Compound Achieves a UL94 V-0 Rating at 3.0 mm, providing excellent Flame-Retardant performance in addition to Conductivity and Structural Strength. This enables Engineers to meet Multiple performance requirements with a Single material Solution.

Because of its combination of Conductivity, Cleanliness, Flame Retardancy and Structural Capability, LNP™ STAT-KON™ DX99873C Compound is widely used in Semiconductor Processing Equipment, Wafer Handling Systems, Electronics Manufacturing Machinery, Automation Equipment, Conductive Fixtures and Precision Engineering Components.

In addition to its Electrical and Mechanical Advantages, LNP™ STAT-KON™ DX99873C Compound is RoHS Compliant, supporting Compliance with Global Environmental Regulations while maintaining Advanced Engineering Performance.

Notes:

LNP™ STAT-KON™ DX99873C Compound
Polycarbonate (PC) Resin
25% Carbon Fiber Reinforced
Surface Resistivity: 1 × 10² to 1 × 10⁶ Ω
LNP™ Clean Compounding Technology
Low Ionic Contamination
Low Nitrates, Low Chlorides
Low Sulfates
Low Outgassing Performance
Low C18-C40 Hydrocarbon Content
UL94 V-0 Rated at 3.0 mm
RoHS Compliant

STAT-KON™ DX99873C Resin has a Flexural Modulus of 9250 MPa. 2 mm/min ISO 178

STAT-KON™ DX99873C Resin offers a Tensile Strain, Break, 5 mm/min of 1.6%. ISO 527

SABIC LNP™ STAT-KON™ DX99873C compound offer HDT, 1.82 MPa of 138°C

LNP™ STAT-KON™ DX99873C Compound Resin has 0.1% Shrinkage, Along flow

STAT-KON® DX99873C Compound are UL94 - V0 @ 3.0 mm

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