STAT-KON EX03319C Compound. Polyetherimide Resin 20% Carbon Fiber

LNP™ STAT-KON™ EX03319C Compound is a High-Performance Polyetherimide (PEI) Compound Reinforced with 20% Carbon Fiber, specifically engineered for Semiconductor, Electronics, Clean Manufacturing and High-Temperature Industrial applications requiring Electrical Conductivity, Exceptional Mechanical performance and Advanced Cleanliness. Produced using Proprietary LNP™ Clean Compounding Technology, STAT-KON™ EX03319C combines Conductive Performance, High Structural Strength, Low Contamination characteristics and Superior Thermal Stability for critical Precision Environments.

Built on a Premium Polyetherimide (PEI) Resin Platform, LNP™ STAT-KON™ EX03319C Compound offers Outstanding Dimensional Stability, High Heat Resistance and Long-Term Mechanical Durability. The addition of 20% Carbon Fiber Reinforcement significantly enhances Stiffness, Strength and Modulus while creating an Effective Conductive Network throughout the Material. This makes the Compound highly suitable for Lightweight Structural components requiring Precision and Electrostatic Control.

A Key Advantage of STAT-KON™ EX03319C is its Conductive Performance. The Compound Exhibits a Surface Resistivity range of approximately 5 × 10³ to 5 × 10⁵ Ω, making it suitable for Conductive and Static Dissipative applications where Electrostatic Discharge (ESD) Protection is Essential. This Conductivity Profile supports Semiconductor Equipment, Wafer Handling Systems, Analytical Instruments, Automation Systems and Electronic Manufacturing Equipment.

Unlike Conventional Conductive Engineering Plastics, LNP™ STAT-KON™ EX03319C is Manufactured using Advanced LNP™ Clean Compounding Technology, developed to Minimize Contamination in Sensitive Manufacturing Environments. The formulation features reduced Levels of Ionic Contaminants including Nitrates, Chlorides and Sulfates, helping Improve Cleanliness and Process Reliability.

Another Major benefit is its Low Non-Volatile Residue (NVR) and Low Contamination Profile. The material is engineered to reduce Volatile and Residual Contaminants that may Accumulate on Sensitive Surfaces. This helps Lower the Risk of Wafer Damage while supporting more accurate Inspections, Measurements and Data Collection in Semiconductor and Electronics Manufacturing Operations.

The 20% Carbon Fiber Reinforcement provides Exceptional Rigidity and Mechanical Performance. The Compound delivers High Stiffness, High Strength and excellent Dimensional Stability, allowing components to maintain Tight Tolerances and Structural Integrity under Mechanical and Thermal Stress. This makes the material particularly attractive for Precision Engineering applications.

In addition, the PEI Resin Platform provides Outstanding High Heat Resistance, enabling the material to maintain performance at Temperatures where many Conventional Engineering Thermoplastics Experience Property Degradation. This allows STAT-KON™ EX03319C Compound to perform reliably in demanding Thermal Environments.

The material also offers a Strong Strength-To-Weight Ratio, allowing Engineers to reduce Part Weight without Sacrificing Mechanical Integrity. Combined with its Conductive performance and Cleanliness Characteristics, this makes the Compound an excellent Choice for Advanced Manufacturing Equipment and High-Performance Industrial Systems.

Because of its combination of Conductivity, Cleanliness, Thermal Stability and Structural Strength, LNP™ STAT-KON™ EX03319C Compound is commonly used in Semiconductor Process Equipment, Wafer Handling Components, Electronic Manufacturing Machinery, Precision Automation Systems, Analytical Instruments and Contamination-Sensitive Engineering applications.

In addition to its Electrical and Mechanical Advantages, LNP™ STAT-KON™ EX03319C Compound is RoHS Compliant, supporting Compliance with Global Environmental Regulations while maintaining Advanced Engineering Performance.

Notes:

LNP™ STAT-KON™ EX03319C Compound
Polyetherimide (PEI) Resin
20% Carbon Fiber Reinforced
Surface Resistivity: 5 × 10³ to 5 × 10⁵ Ω
LNP™ Clean Compounding Technology
Low Ionic Contamination
Low Nitrates, Low Chlorides, Low Sulfates
Low Non-Volatile Residue (NVR)
Low Contamination Profile
RoHS Compliant